Heatsink silicone thermal pad 100 x 100 x 1 mm

Description: Heatsink silicone thermal pad 100 x 100 x 1 mm Silicone thermal pad designed for merging with heat sinks It facilitates the removal of heat from the processor, chipset and processor to the heat sink Excellent thermal impedance It provides stability, perfectly merges, does not stratify, does not oxidize. It does not conduct electricity | Color: Gray | Dimensions: 100 x 100 x 1 mm | Weight: 23 | Other parameters: Thermal conductivity: 2.0 W / m-K Specific gravity: 1.7 + 0.1 g / cm3 Hardness: 40 5 Shore C Continuous temperature of use: -40 ... +250 Dielectric breakdown voltage: 3-5 KV Dielectric constant: 4.5 - 5.5 1M Hz Volumetric resistivity:> 4.0 x 1011 cm Flame rating: V-0 Thermal impedance: 0.18 ... 0.25 -w2 / W