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Aerocool COG4 heat sink compound Thermal paste 8.5 W/m·K 4 g – photo 1
Aerocool COG4 heat sink compound Thermal paste 8.5 W/m·K 4 g – photo 2
Aerocool COG4 heat sink compound Thermal paste 8.5 W/m·K 4 g – photo 3
AEROCOOL

Aerocool COG4 heat sink compound Thermal paste 8.5 W/m·K 4 g

R863
incl. VAT: R993
  • Stock: Backordered - ETA 7-10 Days
  • Brand: AEROCOOL
  • Model: ACTG-NA64210.01
  • EAN: 4710562755503
  • Product code: 479026
Backordered goods Delivery in 7–10 working days

Available Options

R863 incl. VAT: R993

Key features

  • Thermal paste 8.5 W/m·K
  • 3.25 g/cm³
  • Constitutive ingredients: Carbon, Metal oxide, Silicone
  • 1 pc(s)

Key features

  • Thermal paste 8.5 W/m·K
  • 3.25 g/cm³
  • Constitutive ingredients: Carbon, Metal oxide, Silicone
  • 1 pc(s)

Description

High-performance thermal paste specially designed for overclocking or gaming PCs. Easy to apply and perfectly fills the space between your cooler and CPU. Nanotechnology in the paste improves heat conduction via its micro molecules. Made with non-electric conductive materials, this thermal paste is completely safe to use. Comes with a spreader for quick and easy application.

Price History

Price History

Current price863 ZAR
89687886008-2409-0609-1910-0310-1610-29
Regular price

Specifications

Features
Type Thermal paste
Thermal conductivity 8.5 W/m·K
Constitutive ingredients Carbon, Metal oxide, Silicone
Viscosity note 1000 poise
Specific gravity 3.25 g/cm³
Operating temperature (T-T) -30 - 280 °C
Weight & dimensions
Weight 4 g
Packaging data
Quantity per pack 1 pc(s)